Printed Circuit Board Assemblies   Printed circuit board assembly using IPC610 Class II Standards, Lean Manufacturing Methodology, and Total Quality Measurement standards. Separate manufacturing lines doing RoHS compliant and non RoHS assembly      – SMT (placement to 0201) – BGA (Up to 508 x 457 mm) – Through hole (manual and automated) –  Burn-in capabilities, thermal and life cycle – Conformal coating (manual and automated) – Ionization level testing – RF, ICT, Functional, ATE Testing

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